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weVISION: Vertical Reality – 3D TSV . . . with Rick Hill of Novellus (video)

Posted on: 12-Aug-2010 Page Views: 3361
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Summary In this interview we delve into what’s new in packaging and how their new products help chip makers drive down costs and raise yields. Novellus recently introduced a complete line of new products that address longstanding issues in TSV, such as heavy electrofill overburdens that slow down CMP and drive up costs. Rick talks not only about how Novellus is striving to eliminate CMP, which is not a value added step, but also about how the company’s newest systems help to reduce voids and defects.
About weVISION:
weVISION is a series of video interviews of visionaries by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Environment, Electronics, healthcare and Business divisions.
Short URL: http://electronics.wesrch.com/weqEL1LV5A
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