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Company: VLSI Research Inc
| 11-Jun-07 | 1910 |
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Company: Agilent Technologies
BARCELONA, Spain---Agilent Technologies Inc. (NYSE:A) today introduced the Agilent E6651A Mobile WiMAX Test Set, enabling designers and manufacturers to accelerate time-to-market for their IEEE802.16e subscriber products. Created in conjunction with ...
| 12-Feb-07 | 993 |
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Company: AMD
AMD Quad FX Platform with Dual Socket Direct Connect Architecture Endorsement Quotes
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| 26-Jan-07 | 1134 |
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Company: AMD
—AMD’s Stable Infrastructure Strategy Enables Availability of Systems from Platform Partners in September—
Sunnyvale, Calif. -- June 29, 2007 --Continuing to lead the shift of mainstream enterprise computing to energy-efficient p ...
| 02-Jul-07 | 1438 |
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Company: Applied Materials
SANTA CLARA, Calif.-(Feb. 13) -- Applied Materials, Inc. today announced its intention to cease future development of beamline implant products for semiconductor manufacturing and close the operations of its Applied Implant Technologies group based i ...
| 13-Feb-07 | 1059 |
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Company: APPLIED-MATERIALS
Applied Materials' UVision 3 Sets Benchmark for Brightfield Inspection Sensitivity and Productivity
Business Editors/High-Tech Writers
MULTIMEDIA AVAILABLE:
http://www.businesswire.com/cgi-bin/mmg.cgi?eid=5553778
SANTA CLARA ...
| 26-Nov-07 | 1934 |
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Company: Sematech
Austin, TX - Dr. Sitaram R. Arkalgud has been
named Director of Sematech's new 3D interconnect initiative, announced
Giang Dao, Sematech vice president and chief operating officer for
Advanced Technology.
While on assignment to Semate ...
| 04-Jan-07 | 1005 |
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Company: ASML
VELDHOVEN, the Netherlands, January 17, 2007 – ASML Holding NV (ASML) today announced 2006 annual and fourth quarter results according to US GAAP as follows:
...
| 17-Jan-07 | 1084 |
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Company: Sematech
San Jose, CA (28 February 2007) - SEMATECH\'s program in developing solutions for extreme ultraviolet lithography (EUVL) infrastructure has brought the technology out of proof-of-feasibility and into the realm of identifying manufacturing challenge ...
| 28-Feb-07 | 900 |
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Company: Brion Technologies and Tool Corp.
SANTA CLARA, Calif., January 18, 2007 — TOOL Corp. and U.S.-based Brion Technologies Inc. today announced the successful development of an integrated IC design environment that incorporates both TOOL’s versatile layout visualization platf ...
| 18-Jan-07 | 1262 |
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Company: BOC Edwards
LONDON--CCMP Capital, through affiliates of CCMP Capital Advisors LLC and CCMP Capital Asia, Ltd., premier international private equity firms, have reached agreement with The Linde Group, the global gases company, to acquire BOC Edwards, a leading ma ...
| 12-Mar-07 | 1107 |
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Company: Chartered Semiconductor Manufacturing and Tezzaron Semiconductor Corp.
Leading foundry, innovative chip designer will also collaborate on breakthrough 3D ICs using wafer stacking approach
MILPITAS, Calif. – June 12, 2007 – Chartered Semiconductor Manufacturing (Nasdaq: CHRT and SGX-ST: Chartered), one o ...
| 12-Jun-07 | 2208 |
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Company: Pixer Technology
Pixer Technology appoints Dr. Steven Labovitz as Director of Strategic Marketing in North America Office
Silicon Valley, California – October 24, 2007 -- Pixer Technology Inc. (Pixer), today announced the appointment of Dr. Steven Labovitz a ...
| 24-Oct-07 | 1985 |
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Company: FEI
OCTOBER 15, 2007/Hillsboro, Ore.—FEI Company (Nasdaq: FEIC), widely acknowledged as the leading innovator for ultra-high resolution transmission electron microscopes (TEMs), has added a revolutionary new instrument, the Titan3™ 80-300 to ...
| 15-Oct-07 | 1700 |
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Company: FormFactor
LIVERMORE, Calif.--FormFactor, Inc. (Nasdaq:FORM) today announced a major milestone with the shipment of its first 26,000 pin-count wafer probe card, which is based on its new PH150XP platform. Representing the highest pin-count product manufacture ...
| 25-Apr-07 | 1548 |
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Company: Freescale Semiconductor
Austin, Texas and Armonk, New York – January 23, 2007 – Freescale Semiconductor and IBM today announced that Freescale will join the IBM technology alliance for joint semiconductor research and development.
The agreement includes Comple ...
| 23-Jan-07 | 1282 |
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Company: Gartner
STAMFORD, Conn.--(BUSINESS WIRE)--For the second consecutive quarter, Hewlett-Packard was the No. 1 vendor based on worldwide PC shipments, and it finished 2006 tied with Dell as the leader of worldwide PC shipments, according to preliminary results ...
| 18-Jan-07 | 920 |
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Company: Renesas, Hitachi
TOKYO----Feb. 16, 2007--In addressing the need for
next-generation high-density on-chip non-volatile memory technology,
Hitachi, Ltd. and Renesas Technology Corp. today announced the
development of a 512-kbyte (4-Mbit equivalent) phase change m ...
| 16-Feb-07 | 965 |
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Company: IBM
YORKTOWN HEIGHTS, NY, January 27, 2007 . . . IBM (NYSE: IBM) today announced it has developed a long-sought improvement to the transistor – the tiny on/off switch that serves as the basic building block of virtually all microchips made today.
...
| 26-Jan-07 | 1572 |
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Company: IBM
Armonk, N.Y. -- IBM announced today that the company has begun producing a new, 65 nanometer (nm) version of the Cell Broadband Engine at IBM’s state-of-the-art East Fishkill, New York microchip production facility.
The revolutionary Cell c ...
| 12-Mar-07 | 735 |
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