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苹果iPad A5x三星45nm工艺处理器

  
Company: Chipworks
它已经证实,苹果的iPad A5x处理器三星45nm工艺制成,根据Chipworks公司最新的拆解z ...

17-Mar-12609
 

DNA Electronics and Ion Torrent Sign License Agreement

  
Company: DNA Electronics
LONDON,August 3, 2010- DNA Electronics Ltd., an innovator of semiconductor solutions for healthcare, announced today that it has signed a non-exclusive, worldwide license agreement to provide Ion Torrent, the semiconductor s ...

03-Aug-10609
 

TPK to Start Volume Production for Touch-on–Lens, Also Issues Dividend

  
Company: TPK
TPK company chairman Michael Chiang confirmed that the company will begin volume production of Touch on Lens (ToL) single glass touch screen in July despite the brooding competition from OGS (One Glass Solution) and in-cell touch solutions. Accord ...

17-Mar-12609
 

40 Percent Faster Runtime and Enhanced High-Performance Core Design Capabilities Drive Adoption of M

  
Company: Magma
SAN JOSE, Calif., Nov. 30, 2011 - Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, today announced that recent improvements to the Talus® 1.2 integrated circuit (IC) implementation platform have triggered a ...

01-Dec-11608
 

Call for Papers - Asia Symposium on Quality Electronic Design ASQED2012

  
Company: ASQED2012
T4th Asia Symposium on Quality Electronic Design (ASQED2012) July 10-11 2012 Malaysia http://www.asqed.com PAPER SUBMISSION DEADLINE: April 4, 2012 The Asia Symposium on Quality Electronic Design, a leading international ...

04-Jan-12608
 

High Reliability Connectors from C&K Components Shorten Satellite Assembly Integration Time

  
Company: C&K Components
C&K Components, a leading international supplier of tact switches, toggle, rocker and pushbutton switches, and smart card interconne ...

08-Jun-10608
 

ITT Interconnect Solutions’ circular bayonet databus connector enables reliable data transmission

  
Company: ITT Interconnect Solutions
ITT Interconnect Solutions, a leading global manufacturer and supplier of connectors, interconnects and cable assemblies, has developed a circular bayonet databus connector for reliable data transmission between rail ...

11-May-10608
 

NOVELLUS SYSTEMS ANNOUNCES JOINT DEVELOPMENT PROGRAM ON COPPER THROUGH-SILICON-VIA (TSV) FOR 3-D SE

  
Company: Novellus
Type or Copy and Past San Jose, California – March 17, 2010 – Novellus Systems (NASDAQ: NVLS) today announced the establishment of a joint development program (JDP) with the IBM Corporation (NYSE: IBM) to design a manufacturing-worthy, c ...

17-Mar-10608
 

NOVELLUS SYSTEMS LAUNCHES SOLA® xT UVTP SYSTEM FOR SUB-45nm HIGH VOLUME MANUFACTURING

  
Company: Novellus
Flexible Multistation Sequential Processing (MSSP) Architecture Delivers ULK Films With 25 Percent Hardness Improvement over Competitive Approach San Jose, California – January 13, 2010 – Novellus Systems (NASDAQ: NV ...

15-Jan-10608
 

SETsquared company Blu Wireless wins Cambridge start-up prize

  
Company: Blu Wireless Technology
December 19th 2011 - Blu Wireless Technology, based at SETsquared’s Business Acceleration Centre in Bristol, is one of five new technology businesses to win the Cambridge Wireless Discovering Start-Ups 2011 competition. The company was recognis ...

19-Dec-11608
 

U.S. Semiconductor Employment Reaches Nearly 250,000

  
Company: SIA
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that the U.S. semiconductor industry now employs almost a quarter of a million workers and added jobs three times ...

12-Dec-12608
 

Alchimer, developer of nanometric deposition technologies for advanced 3D packaging, TSVs, and other

  
Company: Alchimer
Alchimer, developer of nanometric deposition technologies for advanced 3D packaging, TSVs, and other electronic applications appoints a new CEO - Bruno Morel and CTO - Frédéric Raynal.

09-Nov-12607
 

Altatech Semiconductor Introduces Inspection System for Wafer Edges

  
Company: Altatech Semiconductor
Altatech Semiconductor Introduces EyeEdge® System, Surpassing Capabilities of Laser-Based Systems in Inspecting Wafer Edges and Controlling Multi-Layer Overlap High-Throughput Optical Inspection Technology Available in Stand-Alone System or M ...

29-Nov-10607
 

Bringing NFC Wireless Communications to the Masses

  
Company: Samsung
Samsung Telecommunications America (Samsung Mobile) is helping consumers realize the potential of NFC technology today with the creation ofSamsung TecTiles™ and the TecTile™ programming application. With the largest user base of NFC-enabl ...

14-Jun-12607
 

SETsquared company TopicLogic wins at UK Discovering Start-ups 2012

  
Company: SETsquared
November 27th, 2012 - TopicLogic, a company supported by the SETsquared Partnership, has been announced as a winner at the nationwide Discovering Start-Ups 2012 competition. TopicLogic was one of five wireless entrepreneurs who were recognised by l ...

27-Nov-12607
 

TradeDoubler Rebrands The Search Works to TD Search in UK and France

  
Company: TradeDoubler
London, 20 October 2009 – TradeDoubler, the number one pan-European digital marketing company, today announced that The Search Works in the UK and France will be rebranded to TD Search, effective immediately, bringing it in line with the rest ...

20-Oct-09607
 

Automotive Semiconductors 2011: Renesas Retains Top Spot as Freescale Slips

  
Company: Strategy Analytics
Renesas Electronics overcame the challenges of the March 2011 Tohoku Pacific coast earthquake in Japan, that had disrupted key front end fabrication operations, in order to retain a 14 percent market share in the automotive semiconductor market&m ...

20-Apr-12606
 

Cambridge's TTP pioneer a new wireless technology using white space to offer a solution to emergency

  
Company: TTP
November 9th 2011 - White space spectrum could radically improve emergency services communications and deliver valuable new data-rich applications to help save lives, claims TTP, one of the UK companies pioneering this ground-breaking new wireless ...

09-Nov-11606
 

Cloud Computing expected to reach $214 billion, as IBM rolls out new tools for business

  
Company: IBM
Expected to grow to more than $214 billion by 2020,* cloud computing has become a catalyst for capturing new business value through innovation, stronger customer relationships, and faster time to market while reducing cost and complexity. IBM (NYS ...

29-Feb-12606
 

First Businesspost and Pagero sign e-invoicing interoperability agreement

  
Company: First Businesspost GmbH
October 5th 2011 - Pagero and First Businesspost are members of VeR and have used the legal and technical framework of VeR for this implementation. We believe that interoperability is crucial in growing the e-invoicing market to leverage business b ...

05-Oct-11606
 
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