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3D Integration- A Solution for next Generation Silicon Devices

Author: Dr. Daniel Shi Share [+]
Views:1156
Domain:  High Tech; Category: Semiconductors
Paper Summary:  3D integration is another major solution to increase IC density and functionality. Annual growth rate of all the 3D packaging is more than 24%, while the rate of the TSV based 3D packaging is more than 95%. 3D packaging/integration technology is believed to have many applications including consumer electronics, wireless communication, bio-medical devices, aerospace, and automotive, etc. ASTRI has established a comprehensive 3D packaging technology platform for HK/China packaging industry.  
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