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SRC GRC University Research Highlights May 2007 SRC GRC University Research Highlights May 2007
Author: Dale Edwards, William Joyner, David Yeh, Tim Wooldridge, Daniel Herr, Harold Hosack   Saved 4 time(s)   Pages Viewed: 1046
07-Jun-0710331
SRC GRC University Research Highlights, August 2007 SRC GRC University Research Highlights, August 2007
Author: Dale Edwards, William Joyner, David Yeh, Daniel Herr, Kwok Ng, Scott List   Saved 4 time(s)   Pages Viewed: 1121
13-Sep-0711171
Tablet Market Structure, Growth & Challenges Tablet Market Structure, Growth & Challenges
Author: Robert Thompson   Saved 4 time(s)   Pages Viewed: 3156
26-Sep-1111623
Tessera's microPILR interconnect technology Tessera's microPILR interconnect technology
Author: WeSRCH Poster   Saved 4 time(s)   Pages Viewed: 1157
16-Apr-0710011
The Future of DRAM: a mobile opportunity The Future of DRAM: a mobile opportunity
Author: Yukio Sakamoto   Saved 4 time(s)   Pages Viewed: 3248
24-Apr-126545
The Obama Administration's Science and Technology Priorities The Obama Administration's Science and Technology Priorities
Author: Dr. W. F. Brinkman   Saved 4 time(s)   Pages Viewed: 1157
06-Oct-1011331
The Strategy Behind TI’s Manufacturing Model The Strategy Behind TI’s Manufacturing Model
Author: Texas Instruments   Saved 4 time(s)   Pages Viewed: 1264
23-Sep-0712601
The Texas Surprise The Texas Surprise
Author: Gary Smith   Saved 4 time(s)   Pages Viewed: 1904
15-Feb-0719041
3D IC Manufacturing Thin Wafer Handling Progress
Author: Wei-Chung Lo   Saved 4 time(s)   Pages Viewed: 1661
19-Jan-1111791
This New Chip: IBM’s CMOS Image Sensor (CIS) Foundry. This New Chip: IBM’s CMOS Image Sensor (CIS) Foundry.
Author: G Dan Hutcheson   Saved 4 time(s)   Pages Viewed: 3202
27-Dec-0632021
Time Synchronization Increasing in Importance Time Synchronization Increasing in Importance
Author: Gino Crispieri   Saved 4 time(s)   Pages Viewed: 2430
09-Jan-0724191
3D IC Technology: End User Point of View 3D IC Technology: End User Point of View
Author: Kauppi Kujala, Nokia   Saved 3 time(s)   Pages Viewed: 1604
04-Nov-1011741
3D Interposer Processes and Flows 3D Interposer Processes and Flows
Author: Thorsten Matthias   Saved 3 time(s)   Pages Viewed: 2260
19-Dec-116813
3D SOC Packaging Integration Technology Applications 3D SOC Packaging Integration Technology Applications
Author: Jean Michailos   Saved 3 time(s)   Pages Viewed: 1737
25-Nov-117122
3D TSV IC Processing 3D TSV IC Processing
Author: Sesh Ramaswami   Saved 3 time(s)   Pages Viewed: 1430
01-Dec-1010171
3D TSV Application Status 3DIC Integration with TSV – Current Progress and Future Outlook
Author: Shan Gao, Dim-Lee Kwong   Saved 3 time(s)   Pages Viewed: 3525
14-Dec-1024991
A Green Semiconductor Industry A Green Semiconductor Industry
Author: Rene Penning de Vries   Saved 3 time(s)   Pages Viewed: 2493
06-Jul-116314
Beyond Immersion Lithography: Development Pipelines and EUV Technology Challenges Beyond Immersion Lithography: Development Pipelines and EUV Technology Challenges
Author: Colin Brodsky   Saved 3 time(s)   Pages Viewed: 2721
24-Nov-116794
IBM Cloud Computing Services Cloud Computing Services
Author: Christoph Schwaiger   Saved 3 time(s)   Pages Viewed: 483
29-Dec-104531
CMOS technology beyond 22nm: Where can silicon take us, Future Challenges in Device Scaling, AGENDA, CMOS technology beyond 22nm Where can silicon take us
Author: Kelin J. Kuhn   Saved 3 time(s)   Pages Viewed: 2118
08-Sep-1015981
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