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Direct Stacking of High-k Dielectrics on SiDirect Stacking of High-k Dielectrics on Si
Posted On: 27-Sep-07
Y. Nagasato, Y. Iwazaki, M. Hasumi, T. Ueno and K. Kuroiwa17921792
Complementary Lithography - Stochastics Suppression and EUVComplementary Lithography - Stochastics Suppression and EUV
Posted On: 19-Sep-12
Yan Borodovsky9834947
Computational Lithography @ IntelComputational Lithography @ Intel
Posted On: 26-Jun-07
Yan Borodovsky48536812
NAND Flash Memory, Semiconductor Technology, Free publish online electronics presentations3 Bit Per Cell NAND Flash Memory on 19nm Technology
Posted On: 08-Apr-14
Yan Li PhD18642518
Google Android App Development Google Android App Development
Posted On: 07-Jul-10
Yang Jeong Soo15171577
Defending against internet attacksDefending against internet attacks: Dynamic data flow - Control flow integrity - Shellcode - Heapspray
Posted On: 21-May-15
Yang Yu616679
DEP/ASLR Bypass , ROP/JIT, IT, Electronics Presentations, Security Researching, Upload Free DocumentDEP/ASLR Bypass Without ROP/JIT
Posted On: 28-Apr-14
Yang Yu9681773
IPv6Security infrastructure development with IPv6-aware firewalls
Posted On: 28-May-10
Yanick Pouffary, Distinguished Technologist, HP16571664
EUVL Activities EUVL Activities in China
Posted On: 03-Sep-14
Yanqiu Li, Zhen Cao18061947
Bringing Solid State Drive Benefits to Computer Notebook UsersBringing Solid State Drive Benefits to Computer Notebook Users
Posted On: 26-Jul-07
Yaron Weiler15791582
Bringing Solid State Drive Benefits to Computer Notebook UsersBringing Solid State Drive Benefits to Computer Notebook Users
Posted On: 15-Oct-07
Yaron Weiler17001701
The Impact of IT Investing on the Energy Sector in 2010The Impact of IT Investing on the Energy Sector in 2010
Posted On: 28-Dec-09
Yasuhiro Murota and Kae Takase18611899
Continuous-Time ΣΔ Modulator CMOS DesignContinuous-Time ΣΔ Modulator CMOS Design
Posted On: 29-Jun-11
Ye Tian15481706
Free Air Ball Modeling for Gold Wire Bonding for Different Wire DiametersFree Air Ball Modeling for Gold Wire Bonding for Different Wire Diameters
Posted On: 23-Jul-07
Yee Chen Tan, Boon Hoe Toh, Hong Meng Ho and Jonathan Tan24432577
The Future of Cameras for Mobile ElectronicsThe Future of Cameras for Mobile Electronics
Posted On: 03-Sep-08
Yehudit Dagan, VP Marketing, Tessera19412378
Opportunities in the Mobile Applications Market for Developers Opportunities in the Mobile Applications Market for Developers
Posted On: 30-Dec-09
Yeonhee Park 21902197
Antennas Technology in Wireless SystemsAntennas Technology in Wireless Systems
Posted On: 18-Mar-10
Yi-Cheng Lin20032074
Agent LearningMaritime Domain Awareness via Agent Learning and Collaboration
Posted On: 29-Jul-10
Ying Zhao, Douglas J. MacKinnon, Shelley P. Gallup, Charles Zhou19892006
Spintronic Memory Applications in Microprocessors, IBM Claims Spintronics MemorySpintronic Memory Applications in Microprocessors
Posted On: 19-Sep-13
Yiran Chen18132754
Intel® vPro™ TechnologyIntel® vPro™ Technology to Sync, Share and Manage for ANY Business Need - MeshCentral Open Source Cloud Services
Posted On: 04-May-15
Ylian Saint-Hilaire15211640
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