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Texas Instruments logo. (PRNewsFoto) (Newscom TagID: prnphotos054497)
DALLAS, TX UNITED STATES
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DALLAS, July 23 /PRNewswire-FirstCall/ -- Ericsson (Nasdaq: ERIC), the
world's leading telecom supplier, and Texas Instruments Incorporated (TI)
(NYSE: TXN), the global leader in silicon solutions for wireless
communications, today announced that the companies will form a strategic
technology engagement to develop custom solutions for new Open OS enabled
3G devices.
Solutions from the technology created by the two companies will combine
small and power efficient 3G modems from Ericsson Mobile Platforms with
high-performance OMAP(TM) applications processors from TI. Solutions from
the joint engagement will include OMAP, custom basebands and connectivity
technologies and will be capable of supporting the major Open OS, which
offer easy access to a rich array of applications and services. The result
of this joint effort will enable all device manufacturers to offer advanced
Open OS handsets for both the high-end and the rapidly growing mid-range
market.
The collaboration between Ericsson and TI will enable handset
manufacturers to deliver the exciting mobile entertainment and multimedia
experiences that consumers around the world are increasingly demanding.
Ericsson's access technology leadership, current HSPA-enabled platforms,
and future HSPA evolution and LTE technologies, combined with the
cutting-edge multimedia performance enabled by TI's OMAP 2, OMAP 3 and
future generations of OMAP processors, will continue to push the
performance boundaries of mobile devices and mobile entertainment features.
By leveraging TI's OMAP platform with Open OS support for Windows(R)
Mobile, Symbian S60, Symbian UIQ and Linux(R), these solutions will provide
OEMs and operators with a robust and flexible architecture for applications
and services deployment, enabling easier delivery and management of
services and content. This enables handset manufacturers and mobile
operators to differentiate their products through rich, easy-to-use and
customizable user interfaces, and through a robust and flexible application
architecture.
The result of the joint effort will bring to market an evolving
portfolio of wireless technology platforms with Open OS support to reduce
complexity, investment and time-to-market for device manufacturers. The
solutions, which seamlessly integrate the modem and applications processor,
will be presented in one pre-verified and tested platform reference design.
This approach will drastically reduce development and verification efforts
previously undertaken by device manufacturers, enabling customers to
rapidly bring highly advanced yet competitively priced products to market.
The joint solutions will also benefit from the Ericsson Mobile
Platforms IOT program, one of the industry's most extensive
interoperability testing processes, guaranteeing full compliance with
operator requirements, speeding up time to market and securing an easy
roll-out of products.
Greg Delagi, senior vice president of TI's Wireless Terminals Business
Unit, says: "It's a tribute to the long-standing collaborative relationship
between EMP and TI that we can tap into and combine each company's unique
wireless expertise in order to deliver the most timely, targeted solutions
to the market. TI's broad, proven product portfolio and advanced
manufacturing capabilities have continued to adjust to the demanding
requirements of EMP's customer base. We believe that today's announcement
will build on what TI can bring to EMP and what both companies together can
bring to this vital, dynamic industry."
Robert Puskaric, head of Ericsson's mobile platforms' unit, says:
"Ericsson is clear in its commitment to design and offer a portfolio of
flexible, innovative mobile platforms that address the requirements of the
rapidly evolving mobile device market. We are pleased to work closely with
TI to combine the finest of each company's core wireless know-how -- EMP's
access technology and platform size leadership with TI's innovative OMAP
application processors in order to provide the most capable Open OS
platforms on the market today."
Handsets based on these solutions are expected to be available on the
market in the second half of 2008.
Texas Instruments -- Making Wireless
TI is the leading manufacturer of wireless semiconductors, delivering
the heart of today's wireless technology and building solutions for
tomorrow. TI provides a breadth of silicon and software and over 15 years
of wireless systems expertise that spans handsets and base stations for all
communications standards, wireless LAN, Bluetooth, A-GPS, mobile TV and
Ultra Wideband. TI offers custom to turn-key solutions, including complete
chipsets and reference designs, OMAP(TM) application processors, as well as
core digital signal processor and analog technologies built on advanced
semiconductor processes. Please visit http://www.ti.com/wirelesspressroom
for additional information.
About Texas Instruments:
Texas Instruments Incorporated provides innovative DSP and analog
technologies to meet our customers' real world signal processing
requirements. In addition to Semiconductor, the company includes the
Education Technology business. TI is headquartered in Dallas, Texas, and
has manufacturing, design or sales operations in more than 25 countries.
Trademarks
OMAP is a registered trademark of Texas Instruments. All registered
trademarks and other trademarks belong to their respective owners
s.server=server()
s.channel="News Release"
s.pageName="Ericsson and Texas Instruments to Co-develop Innovative 3G Solutions for Handset Manufacturers"
s.prop2="ind_focus.story"
s.prop3="07-23-2007"
s.prop4=""
s.prop5=""
/************* DO NOT ALTER ANYTHING BELOW THIS LINE ! **************/
var s_code=s.t();if(s_code)document.write(s_code);
//-->
SOURCE Texas Instruments; Ericsson
