IBM, Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES -- forming the world's largest chip-making consortium -- will preview the future of silicon technology at the 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center on March 14.

The companies will address next-generation semiconductor innovation and discuss the Common Platform’s technology - covering critical topics such as 28-, 20- and 14-nanometer processes, as well as innovations beyond 14nm and 450mm wafer manufacturing. Technology jointly developed by the Common Platform companies -- including more than 20 additional member companies -- power the majority of the world's mobile devices and consumer electronics.

Registration for the complimentary, one-day event at the Santa Clara Convention Center opens today. To register visit http://www.meetingconsultants.com/CommonPlatform/IBMBLAST

“The Common Platform alliance is built upon an unmatched legacy of invention and deep commitment to research and development from IBM. The combined expertise of the companies involved is driving truly breakthrough technology innovations for semiconductor manufacturing. Our focus on building the most extensive and open ecosystem around our core manufacturing capabilities delivers customers a flexible and risk-free way to bring a wide range of semiconductor products to market,” said Michael Cadigan, general manager of IBM Microelectronics, on behalf of the Common Platform alliance.

The Common Platform Technology Forum will include keynotes from industry leaders and presentations from senior members of the Common Platform partners’ management and technical teams. A key part of the forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring leading EDA, IP, library, mask, packaging and design services companies.

About the Common Platform

IBM, Samsung and GLOBALFOUNDRIES are members of the Common Platform alliance focusing on leading-edge, jointly developed digital CMOS process technologies and advanced manufacturing. The Common Platform model is further supported by a comprehensive ecosystem of design enablement and implementation partners from the EDA, IP and design services industries. This ecosystem allows foundry customers to source their chip designs to multiple 300mm foundries with minimal design work, unprecedented flexibility and choice.