:: Event Highlights from The ConFab
High-level semiconductor manufacturing executives from around the world are among those presenting at The ConFab this year from May 18 -21, 2008 at Loews Lake Las Vegas Resort in
Las Vegas, Nevada.
:::Confirmed Speakers To Date Include:
- Ben Suh, VP ASIC/Foundry Business Development, Samsung
- Kazuo Ushida, President, Nikon Precision
- Masaaki Kinugawa, Technology Executive, SoC, Toshiba
- Sitaram Akalgud, Director, 3D Interconnect, SEMATECH
:::The conference sessions include:
- The Next Generation Factory
- Economic Implications of 3D: Circuitry & Advanced Packaging
- Next Generation Lithography
- Fab Lite: Is The IDM an Endangered Species?
- Reducing Environmental/Energy Costs
:::The ConFab is a global conference and business meeting where executives from semiconductor equipment and material suppliers meet with key decision makers from semiconductor manufacturers.
Last year, a group of the most important senior executives in the semiconductor industry from over 38 chipmakers and 30 suppliers attended The ConFab. They traveled from every corner of the globe - Asia, the U.S., and Europe - to participate in this exclusive, invitation-only event. At The ConFab, they participated in a one-of-a-kind combination of business meetings and conference sessions. All agreed that the opportunity to network with their peers in a relaxed, open atmosphere proved to be a highly worthwhile experience.
:::Who Attended The ConFab
Attendees from over 38 chipmakers participated.
- 100% of attendees were involved in buying equipment
- Collectively, they represented over $46 billion of buying power in fab equipment over the next two years.
- 89% were at the director level or above.
|If you would like to know more about our list of participants for the 2007 event or want to become a sponsor of
The ConFab in 2008, please call Jay Novack at 603.891.9186 or please email Jay at email@example.com.
:: The Latest From
Solid State Technology's WaferNEWS - www.wafernews.com
Including content from SST's Semiconductor Weekly
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::: Report: Intel's 45nm line causing overseas substrate spike
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