NexPlanar Secures $10 Million for Capacity Expansion of Semiconductor CMP Pad Technology
Oregon capacity to triple; global expansion to quickly follow
Hillsboro, Oregon, March 31, 2011 -- NexPlanar Corporation recently completed a $10.0 million round of Series D funding to expand production capacity both in the U.S. and to strategic locations globally.
NexPlanar is able to modulate CMP pad properties, such as pad hardness, pore size and pore density, to develop customized solutions for demanding semiconductor applications and integration schemes, including those for emerging technologies. They announced late last year a corporate move to larger facilities in Hillsboro, Oregon; and earlier this month hired former Applied Materials director, Rajeev Bajaj, as their new CTO.
Series D Funding
Existing investors including InterWest Partners, Blue Run Ventures and Intel Capital participated in the round.
We have proven that we can influence semiconductor market drivers in pad technology, such as very thin film removal, advanced defectivity requirements and multiple integration schemes, commented Jim LaCasse, CEO and President of NexPlanar. Now with growing customer acceptance in the marketplace, we are going to use this next round of funding to both triple production capacity in our new Oregon facility and expand our presence in Asia.
About NexPlanar Corporation
NexPlanar builds the next generation of chemical mechanical planarization (CMP) pads for the semiconductor device industry. NexPlanar uses proprietary nano-domain technology which improves planarity and across wafer uniformity and can be utilized to customize the CMP pads for specific applications. NexPlanars nano-lubricants and patented molded groove technologies allow for low stress CMP (required for the most advanced CMP applications), result in an order of magnitude fewer defects, low slurry consumption processing and lower overall cost of ownership. See www.nexplanar.com.
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