NEWS RELEASE



IMEC reports major progress in EUV



32nm SRAM fabricated using EUV technology in collaboration with ASML and


Applied Materials



SEMICON WEST 2008 - July 15-17, 2008 - Moscone Center - San Francisco -


California - Booth #851




Leuven, Belgium - July 14, 2008 - IMEC reports functional 0.186µm2 32nm


SRAM cells made with FinFETs from which the contact layer was successfully


printed using ASML's full field extreme ultraviolet (EUV) Alpha Demo Tool


(ADT). Applied Materials, using its most advanced deposition systems, was


key to fabricating the ultra-small circuit structures. IMEC also completed


the integration and site acceptance test of the EUV ADT in its 300mm clean


room. Stimulated by these milestones and with a concerted effort from all


those involved in EUV research, IMEC is committed to rapidly advancing EUV


for the 22nm node.



To accelerate the learning on EUV patterning, IMEC decided to integrate the


EUV contact photo in its 32nm SRAM vehicle. Using EUV lithography, a direct


patterning approach of contact holes is proven to be feasible for


integration in a 32nm technology. And the significant extendibility of EUV


lithography shows promise to replace 193nm lithography for the 22nm node


and beyond.



For the front-end-of-line process, IMEC used its high-k/metal-gate FinFET


platform, capable of delivering SRAM cells with sizes below 0.1µm2 suitable


for the 22nm node. The FinFETs consist of HfO2 as dielectric and TiN as


metal gate and NiPt silicide for the source/drain. The critical FinFET


layers were printed using ASML's 1700i and 1900i immersion lithography


tools. The metallization of the 50nm contact holes was realized using


Applied Materials most advanced contact processing modules for inter layer


barrier Ti and TiN, tungsten fill and chemical mechanical polishing.


.


IMEC also successfully completed the integration and site acceptance tests


of the EUV ADT in its 300mm research facility. This paves the way for IMEC


and its partners to fully deploy the tool and examine solutions for the


22nm node. The EUV ADT will be used in IMEC's industrial affiliation


program to identify the key critical issues for EUV lithography and to


propose solutions. This research will include (1) testing and benchmarking


EUV resists using the full-field exposure tool; (2) integrating EUV


lithography in a full CMOS process focusing on the 22nm technology node;


(3) evaluating and improving the worldwide efforts on mask technology and


(4) assessing the performance and stability of the EUV ADT.



IMEC's core partners are being offered the opportunity to use the ADT for


dedicated exposures, bringing in their own proprietary wafers and EUV


reticles.



"Although several critical issues still need to be solved, the acceptance


of the ADT and successful fabrication of 32nm SRAM using EUV are important


milestones in the development of EUV technology, which is considered the


technology for the 22nm half pitch insertion;" said Luc Van den hove, Chief


Operating Officer at IMEC. "Key to the success of our research is the


presence of leading tool suppliers with their latest tools on-site,


collaborative research between local staff and on-site residents from IDMs,


foundries, equipment and material suppliers. Such collaborations are


indispensable for the semiconductor industry to keep Moore's momentum."



These results were obtained in collaboration with IMEC's sub-32nm CMOS


partners including Intel, Micron, Panasonic, Qimonda, Samsung, TSMC, NXP,


Elpida, Hynix, Powerchip, Infineon, TI, ST Microelectronics.



The news release and picture can be downloaded at:


http://www.imec.be/wwwinter/mediacenter/en/EUVSemWest.shtml



About IMEC


IMEC is a world-leading independent research center in nanoelectronics and


nanotechnology. IMEC vzw is headquartered in Leuven, Belgium, has a sister


company in the Netherlands, IMEC-NL, offices in the US, China and Taiwan,


and representatives in Japan. Its staff of more than 1600 people includes


more than 500 industrial residents and guest researchers. In 2007, its


revenue (P&L) was EUR 244.5 million.


IMEC's More Moore research aims at semiconductor scaling towards sub-32nm


nodes. With its More than Moore research, IMEC looks into technologies for


nomadic embedded systems, wireless autonomous transducer solutions,


biomedical electronics, photovoltaics, organic electronics and GaN power


electronics.



IMEC's research bridges the gap between fundamental research at


universities and technology development in industry. Its unique balance of


processing and system know-how, intellectual property portfolio,


state-of-the-art infrastructure and its strong network worldwide position


IMEC as a key partner for shaping technologies for future systems.



Further information on IMEC can be found at www.imec.be.



Contacts:


IMEC : Katrien Marent, Director of External Communications, T: +32 16 28 18


80, M: +32 474 30 28 66, katrien.marent@imec.be



Barbara Kalkis, Maestro Marketing & PR, T: 1+1 408 996 9975, M: +1 408 529


4210, kkalkis@compuserve.com