IMEC reports major progress in EUV

32nm SRAM fabricated using EUV technology in collaboration with ASML and

Applied Materials

SEMICON WEST 2008 - July 15-17, 2008 - Moscone Center - San Francisco -

California - Booth #851

Leuven, Belgium - July 14, 2008 - IMEC reports functional 0.186µm2 32nm

SRAM cells made with FinFETs from which the contact layer was successfully

printed using ASML's full field extreme ultraviolet (EUV) Alpha Demo Tool

(ADT). Applied Materials, using its most advanced deposition systems, was

key to fabricating the ultra-small circuit structures. IMEC also completed

the integration and site acceptance test of the EUV ADT in its 300mm clean

room. Stimulated by these milestones and with a concerted effort from all

those involved in EUV research, IMEC is committed to rapidly advancing EUV

for the 22nm node.

To accelerate the learning on EUV patterning, IMEC decided to integrate the

EUV contact photo in its 32nm SRAM vehicle. Using EUV lithography, a direct

patterning approach of contact holes is proven to be feasible for

integration in a 32nm technology. And the significant extendibility of EUV

lithography shows promise to replace 193nm lithography for the 22nm node

and beyond.

For the front-end-of-line process, IMEC used its high-k/metal-gate FinFET

platform, capable of delivering SRAM cells with sizes below 0.1µm2 suitable

for the 22nm node. The FinFETs consist of HfO2 as dielectric and TiN as

metal gate and NiPt silicide for the source/drain. The critical FinFET

layers were printed using ASML's 1700i and 1900i immersion lithography

tools. The metallization of the 50nm contact holes was realized using

Applied Materials most advanced contact processing modules for inter layer

barrier Ti and TiN, tungsten fill and chemical mechanical polishing.


IMEC also successfully completed the integration and site acceptance tests

of the EUV ADT in its 300mm research facility. This paves the way for IMEC

and its partners to fully deploy the tool and examine solutions for the

22nm node. The EUV ADT will be used in IMEC's industrial affiliation

program to identify the key critical issues for EUV lithography and to

propose solutions. This research will include (1) testing and benchmarking

EUV resists using the full-field exposure tool; (2) integrating EUV

lithography in a full CMOS process focusing on the 22nm technology node;

(3) evaluating and improving the worldwide efforts on mask technology and

(4) assessing the performance and stability of the EUV ADT.

IMEC's core partners are being offered the opportunity to use the ADT for

dedicated exposures, bringing in their own proprietary wafers and EUV


"Although several critical issues still need to be solved, the acceptance

of the ADT and successful fabrication of 32nm SRAM using EUV are important

milestones in the development of EUV technology, which is considered the

technology for the 22nm half pitch insertion;" said Luc Van den hove, Chief

Operating Officer at IMEC. "Key to the success of our research is the

presence of leading tool suppliers with their latest tools on-site,

collaborative research between local staff and on-site residents from IDMs,

foundries, equipment and material suppliers. Such collaborations are

indispensable for the semiconductor industry to keep Moore's momentum."

These results were obtained in collaboration with IMEC's sub-32nm CMOS

partners including Intel, Micron, Panasonic, Qimonda, Samsung, TSMC, NXP,

Elpida, Hynix, Powerchip, Infineon, TI, ST Microelectronics.

The news release and picture can be downloaded at:

About IMEC

IMEC is a world-leading independent research center in nanoelectronics and

nanotechnology. IMEC vzw is headquartered in Leuven, Belgium, has a sister

company in the Netherlands, IMEC-NL, offices in the US, China and Taiwan,

and representatives in Japan. Its staff of more than 1600 people includes

more than 500 industrial residents and guest researchers. In 2007, its

revenue (P&L) was EUR 244.5 million.

IMEC's More Moore research aims at semiconductor scaling towards sub-32nm

nodes. With its More than Moore research, IMEC looks into technologies for

nomadic embedded systems, wireless autonomous transducer solutions,

biomedical electronics, photovoltaics, organic electronics and GaN power


IMEC's research bridges the gap between fundamental research at

universities and technology development in industry. Its unique balance of

processing and system know-how, intellectual property portfolio,

state-of-the-art infrastructure and its strong network worldwide position

IMEC as a key partner for shaping technologies for future systems.

Further information on IMEC can be found at


IMEC : Katrien Marent, Director of External Communications, T: +32 16 28 18

80, M: +32 474 30 28 66,

Barbara Kalkis, Maestro Marketing & PR, T: 1+1 408 996 9975, M: +1 408 529