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3D IC Packaging Enablement Challenges Ahead - a panel of experts, High Tech

3D IC Packaging Enablement Challenges Ahead - a panel of experts 3D IC Packaging Enablement Challenges Ahead - a panel of experts

Electronics Papers about 3D IC Packaging Enablement Challenges Ahead - a panel of experts, How to enable building the 3D ecosystem and Ceramic and Organic interposers with weSRCH.com.

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electronics papers, 

3d ecosystem, 

organic interposers

Author: Herb Reiter (Fellow) | Visits: 4758 | Page Views: 7220
 
Domain:  High Tech Category: Semiconductors Subcategory: Packaging 
Upload Date: 23rd-Oct-2012  Click On Above Link To See More
Reference: The GSA /SEMATECH Memory+ Conference
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