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InP DHBTs by Leveraging Heterogeneous Integration, Electronics

InP DHBTs by Leveraging Heterogeneous Integration InP DHBTs by Leveraging Heterogeneous Integration

Deep Sub-Micron CoSMOS technology overview: combines latest CMOS and InP DHBTs for high performance mixed signal design. Integration approach: Epitaxial transfer and fabrication of InP HBTs on top of fully fabricated CMOS - InP/Si BiCMOS Process flow Device performance Thermal Management Thermal Vias Metallic Sub-Collector (MSC) Extends Thermal Limits. HBTs CMOS Heterogeneous Interconnect Differential Amplifier Test vehicle Next generation development Thermal limits Metallic Sub-Coll.

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Author: James Chingwei Li, HRL Laboratories LLC (Fellow) | Visits: 1503 | Page Views: 1700
Domain:  High Tech Category: Semiconductors Subcategory: HBT 
Upload Date: 2010-06-07 11:02:58  
Short URL: http://electronics.wesrch.com/pdfEL1SE145ACNDS

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