Topics discussed: IBM Technology Roadmap, Improved Gate Length Scaling with High-k / Metal Gate, 32/28LP HKMG Technology, SRAM Vmin improvement with High-k, Scaling on Mixed Signal / RF Key Figures of Merits, High Performance 28G Technology, Physical IP is more than NAND gates, Moore’s Law and Consumer Expectations, ARM 32nm Test Chip Program Objectives, 32nm Test Chip Overview, Litho-driven Interconnect Optimization, 32 nm vs. 45 nm: Test Chip Results and more.
