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Author:
Gary Smith
(Fellow)
Reads:
1903
Pages Viewed:
1903
Upload Date:
15th-Feb-2007
Conclusion
In order to address the so called Semiconductor Consolidation it is neccesary to understand exactly what is happening, what is driving the consolidation, and who is being affected.
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michael hou
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http://electronics.wesrch.com/paperEL1SE1U21X305
Comments below ordered by Most Recent First
Krystyna Hutcheson
Member
Comment :
If 8" Fabs are capable, why is everyone building 300mm? This
conclusion isn't supported by the evidence. It only makes sense
for older technologies -- the component suppliers written about
above.
Comment
If 8" Fabs are capable, why is everyone building 300mm? This conclusion isn't supported by the evidence. It only makes sense for older technologies -- the component suppliers written about above.
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David Lammers
Member
Comment :
Gary, TI and others claimed that keeping process development
(including circuit models) and design closely linked would be
needed to keep variability under control. Will the design task be
more difficult if the designers are in Dallas and the process
development engineers in Taiwan? Does anything change in terms
of how DFM is implemented?
Comment
Gary, TI and others claimed that keeping process development (including circuit models) and design closely linked would be needed to keep variability under control. Will the design task be more difficult if the designers are in Dallas and the process development engineers in Taiwan? Does anything change in terms of how DFM is implemented?
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