China’s Impact on the Semiconductor Industry, High Tech, Page 49
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| Page content: China's share of current wafer fab capacity allocated to IC integrated device manufacturers (IDM) has diverged further from the worldwide average. IC IDM capacity now represents only 29% of China's current wafer fab capabilities versus the 65% average worldwide. This is primarily a result of the closure of the Hynix-Numonyx 200mm facility, but it is also impacted by the addition of the 13 facilities to the WFW database during 2008. The figure could drop still further, to 28% by 2013, if all of the committed wafer fabs under construction are completed and ramped to full production. Under any scenario, China represents only slightly more than 4% of worldwide IC IDM capacity. This divergence probably had been the result of the timing of China's opening the semiconductor sector to foreign investments, an election to mimic the Taiwan foundry model and the very weak market position of China's state-owned semiconductor companies. It is now being exacerbated by China's focus on developing the IC Design (fabless) sector. Currently there are only seven foreign IDMs with some form of invested wafer fabrication capacity in China: Hynix, Intel, NEC (Hua Hong and SG JVs), Numonyx, NXP (ASMC and JiLin JVs), ON and ProMOS. At the same time, China's share of wafer fab capacity allocated to the OSD sector has increased. OSD capacity now represents 19% of China's current wafer fab capabilities versus 12% of worldwide. It could decrease to 16% for China versus 11% worldwide by 2013 if all of the committed wafer fabs under construction are completed and ramped to full production. However, in either case, China represents more than 15% of worldwide OSD capacity. As of May 2009, WFW shows there were eight additional new wafer fabs announced and/or planned (i.e., WFW probability of =/>0.45 <0.80) for China that had not been committed by the start of construction. This is one less than a year ago and represents 20% of the 40 new fabs announced and/or planned worldwide, but only 11% of their equivalent capacity. The number of such announced and/or planned but not committed new fabs worldwide has decreased noticeably from 54 to 40 in the last year. If all of these additional new fabs were completed and ramped into full production at mature yields, China's share of total worldwide semiconductor wafer production would increase from the approximate 2% realized in 2003 to 10.3% by 2015. This is somewhat lower than the plans of three or four years ago and could have an only moderate impact on the semiconductor industry. While it remains unlikely that all of these announced and/or planned wafer fab plants will be realized, they do provide a measure of the evolving prospects for China's semiconductor industry. Five of the eight will be 12-inch (300mm) fabs, which would account for 78% of the potential additional capacity. The other three are 8-inch (200mm) fabs. Six of the eight are planned for foundry and two for IC IDM production. There are no new announced and/or planned OSD, MEMS or R&D fabs in China at this time. Elpida, (Japan), Siltera (Malaysia), UMC (Taiwan) and Ultimate (Malaysia) are involved with four of these eight possible additional wafer fabs, including the smallest (Ultimate) and the largest (Elpida). All told, these represent 59% of possible additional capacity. PricewaterhouseCoopers 49 | ||||||

























