<?xml version="1.0" encoding="ISO-8859-1"?>
<rss version="2.0">
<channel>
<title>WeSRCH.com: Proceedings</title>
<copyright>Copyright (c) 2012 VLSI Research Inc. All rights reserved.</copyright>
<link>http://electronics.wesrch.com/Paper/My_papers/proceeding.php</link>
<description>Proceedings</description>
<language>en-us</language>
<lastBuildDate>Thu, 17 May 2012 03:00:56 -0700</lastBuildDate>	<item>
	<title>D2-2B - Tissue Engineering / Bionanotechnology and BioMEMS</title>
	<link><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL11GS0]]></link>
	<description><![CDATA[Conference held at Biopolis, Singapore from 2 to 4 December 2009.

]]></description>
	<pubDate>2010-04-02 08:54:26</pubDate>
	<guid isPermaLink='true'><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL11GS0]]></guid>
	</item>	<item>
	<title>Industry Forecast Seminar Mid-Term Update</title>
	<link><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL1HTR7]]></link>
	<description><![CDATA[Topics to be reviewed include: World Economic Environment, 2009 Growth Prospects, Semiconductor Market 5-Year Forecast, Market Trends &amp; Outlook.  For full details of seminar agenda please refer to the Industry Forecast Seminar Brochure.  http://www.futurehorizons.com/assets/ifs2009-mt-flyer.pdf 

Be the first to hear the honest, up-to-the-minute thoughts and theories from our Future Horizons Analysts. The material presented at our previous forecast seminars has proven to be both accurate and informative and the Industry Forecast Seminar 2009 promises to be no exception.  No matter what sector of the industry your organisation represents, this seminar will provide you with reliable facts and valuable industry in-sights to move your organisation forward in these uncertain times.

]]></description>
	<pubDate>2009-07-27 06:25:56</pubDate>
	<guid isPermaLink='true'><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL1HTR7]]></guid>
	</item>	<item>
	<title>Multiple</title>
	<link><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL17VPJ]]></link>
	<description><![CDATA[Covers Polymers at Surfaces: Adhesion, Tribology and Patterning; Dynamics of Nucleic Acids; Multiscale Modeling: Polymers, Nanocom- 
posites, and Biomacromolecules; Reversibly Associating Polymers: Theory and Ex- 
periments; Hybrid Organic-Inorganic Nanomaterials I: Patterning and Self Assembly; Block Copolymer Thin Films;  Self-assembled Macromolecular Structures; Mechanical Properties of Polymers: Fracture and Adhesion; Organic Electronics: FETs;  Long-Distance Charge Transfer in Biological Systems; Biopolymers: Molecules, Solutions and Network; Con&amp;#64257;nement-Induced Structures in Block Copolymers; DNA and Protein Analysis with Micro and Nano&amp;#64258;uidics]]></description>
	<pubDate>2008-09-29 18:17:52</pubDate>
	<guid isPermaLink='true'><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL17VPJ]]></guid>
	</item>	<item>
	<title>Poster Session</title>
	<link><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL1BBKY]]></link>
	<description><![CDATA[Fourth PEAKS symposium on Wafer-Level Packaging Technology. This symposium is the sixth in a series of PEAKS technology symposiums, which have included topics on Electrochemical Processing for Microelectronics. PEAKS technology symposiums offer an opportunity to focus on the highest levels of technical innovations and research in specific areas of the semiconductor industry. The name PEAKS is meaningful in several ways: the symposiums are held in Northwest Montana's most scenic valley surrounded by mountains and nestled next to the entrance of Glacier National Park's rugged snow-capped PEAKS, and PEAKS also means &quot;the highest level&quot;, &quot;the most important point&quot;, &quot;the highest degree&quot;. PEAKS symposiums provide attendees the time and opportunity to share challenges, theorize on new methods, and collaborate with manufacturers, universities, and suppliers in the semiconductor industry. The beauty of the mountain peaks and our valley attracts hundreds of thousands of visitors year round]]></description>
	<pubDate>2007-11-28 15:47:58</pubDate>
	<guid isPermaLink='true'><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL1BBKY]]></guid>
	</item>	<item>
	<title>TSV - 3D</title>
	<link><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL17KLK]]></link>
	<description><![CDATA[Fourth PEAKS symposium on Wafer-Level Packaging Technology. This symposium is the sixth in a series of PEAKS technology symposiums, which have included topics on Electrochemical Processing for Microelectronics.

PEAKS technology symposiums offer an opportunity to focus on the highest levels of technical innovations and research in specific areas of the semiconductor industry. The name PEAKS is meaningful in several ways: the symposiums are held in Northwest Montana's most scenic valley surrounded by mountains and nestled next to the entrance of Glacier National Park's rugged snow-capped PEAKS, and PEAKS also means &quot;the highest level&quot;, &quot;the most important point&quot;, &quot;the highest degree&quot;.

PEAKS symposiums provide attendees the time and opportunity to share challenges, theorize on new methods, and collaborate with manufacturers, universities, and suppliers in the semiconductor industry. The beauty of the mountain peaks and our valley attracts hundreds of thousands of visitors year round]]></description>
	<pubDate>2007-11-28 15:33:38</pubDate>
	<guid isPermaLink='true'><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL17KLK]]></guid>
	</item>	<item>
	<title>Lead-Free</title>
	<link><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL1LRLJ]]></link>
	<description><![CDATA[Fourth PEAKS symposium on Wafer-Level Packaging Technology. This symposium is the sixth in a series of PEAKS technology symposiums, which have included topics on Electrochemical Processing for Microelectronics.

PEAKS technology symposiums offer an opportunity to focus on the highest levels of technical innovations and research in specific areas of the semiconductor industry. The name PEAKS is meaningful in several ways: the symposiums are held in Northwest Montana's most scenic valley surrounded by mountains and nestled next to the entrance of Glacier National Park's rugged snow-capped PEAKS, and PEAKS also means &quot;the highest level&quot;, &quot;the most important point&quot;, &quot;the highest degree&quot;.

PEAKS symposiums provide attendees the time and opportunity to share challenges, theorize on new methods, and collaborate with manufacturers, universities, and suppliers in the semiconductor industry. The beauty of the mountain peaks and our valley attracts hundreds of thousands of visitors year round]]></description>
	<pubDate>2007-11-28 14:53:33</pubDate>
	<guid isPermaLink='true'><![CDATA[http://electronics.wesrch.com/Paper/My_papers/display_proceedings.php?proceeding_id=EL1LRLJ]]></guid>
	</item></channel>
</rss>
